Mold Type Busduct

The present invention relates to a molded bus duct, and more specifically to a molded bus duct which is compact and reduced in weight compared to the conventional one while transmitting high voltage power by combining air insulation and molding insulation. The molded bus duct comprises: a duct; a pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHOE JIN WOOK, LEE WOONG YUP, SON SI HO, LEE MIN WOO, JUNG EUI HWAN, JEONG GEUN YOUNG
Format: Patent
Sprache:eng ; kor
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention relates to a molded bus duct, and more specifically to a molded bus duct which is compact and reduced in weight compared to the conventional one while transmitting high voltage power by combining air insulation and molding insulation. The molded bus duct comprises: a duct; a plurality of bus bars which are disposed in the duct to be in parallel with one another; a plurality of fixing members which respectively support the bus bars in the duct, are arranged to be spaced apart from one another along the longitudinal direction of the bus bars, and individually have an upper end fastened to the bus bar, and a lower end fastened to the duct; and a plurality of molding parts each of which is configured to surround the outside of each of the bus bars and a portion of the upper part of each of the fixing members. 본 발명은 몰딩형 부스덕트에 관한 것으로서, 공기 절연에 몰딩 절연을 복합하여 고압의 전력 전송을 하면서도 기존 대비 컴팩트하고 중량이 저감된 몰딩형 부스덕트에 관한 것이다.