RADOME POLISHING SYSTEM

An embodiment of the present invention provides a polishing system including a scanner for obtaining scan data by 3D scanning a polishing object to be polished; a processor for modeling the polishing object by extracting outline data on the outline of the polishing object based on the scan data and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHOI YOON HWAN, JANG SUN BONG, KANG KI SEOP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS PHYSICS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	An embodiment of the present invention provides a polishing system including a scanner for obtaining scan data by 3D scanning a polishing object to be polished; a processor for modeling the polishing object by extracting outline data on the outline of the polishing object based on the scan data and determining a polishing path for polishing the modeled polishing object; and a polishing machine for polishing the polishing object according to the polishing path determined by the processor. The polishing system according to the present invention can improve the quality and shorten the time required for polishing compared to the conventional polishing method. 본 발명의 일실시예는 연마하고자 하는 연마 대상을 3D 스캐닝하여 스캔 데이터를 획득하는 스캐너와, 상기 스캔 데이터를 기초로 상기 연마 대상의 외형선에 대한 외형선 데이터를 추출하여 상기 연마 대상을 모델링하고, 모델링된 연마 대상을 연마하기 위한 연마 경로를 결정하는 프로세서와, 상기 프로세서로부터 결정된 연마 경로에 따라 상기 연마 대상을 연마하는 연마기를 포함하는 연마 시스템을 제공한다.