Bonding apparatus of semiconductor chip

The present invention provides a semiconductor chip bonding apparatus capable of correcting a bonding position in real time. The semiconductor chip bonding apparatus includes a bonding head adsorbing and holding the semiconductor chip; a bonding stage on which a substrate on which the semiconductor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM HUI JAE, SHIN JAE BONG, SEOK SEUNG DAE, KIM SANG YOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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