POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

According to the present invention, a window is used for detecting an end point of a polishing pad used in a polishing process when detecting the end point of the polishing process so that it is possible to prevent an error in end point detection by preventing a performance deviation of the end poin...

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Hauptverfasser:	YUN JONG UK, SEO JANG WON, JOENG EUN SUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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creator	YUN JONG UK SEO JANG WON JOENG EUN SUN
description	According to the present invention, a window is used for detecting an end point of a polishing pad used in a polishing process when detecting the end point of the polishing process so that it is possible to prevent an error in end point detection by preventing a performance deviation of the end point detection due to a laser difference of a polishing apparatus. In addition, it is possible to provide a method of manufacturing a semiconductor device to which the polishing pad is applied. In the window, the absorbance gradient uniformity index (ACU) expressed as ACU = (Ax + Ay)/Az may be 1.5 to 2.5. 본 발명은 연마 공정에 사용되는 연마패드의 종점 검출용 윈도우로, 연마 공정의 종점 검출 시, 연마 장치의 레이저 차이로 인한 종점 검출의 성능 편차 발생을 방지하여 종점 검출의 오류를 방지할 수 있다. 또한, 상기 연마 패드를 적용한 반도체 소자의 제조 방법을 제공할 수 있다.
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In addition, it is possible to provide a method of manufacturing a semiconductor device to which the polishing pad is applied. In the window, the absorbance gradient uniformity index (ACU) expressed as ACU = (Ax + Ay)/Az may be 1.5 to 2.5. 본 발명은 연마 공정에 사용되는 연마패드의 종점 검출용 윈도우로, 연마 공정의 종점 검출 시, 연마 장치의 레이저 차이로 인한 종점 검출의 성능 편차 발생을 방지하여 종점 검출의 오류를 방지할 수 있다. 또한, 상기 연마 패드를 적용한 반도체 소자의 제조 방법을 제공할 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220317&DB=EPODOC&CC=KR&NR=20220033666A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220317&DB=EPODOC&CC=KR&NR=20220033666A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUN JONG UK</creatorcontrib><creatorcontrib>SEO JANG WON</creatorcontrib><creatorcontrib>JOENG EUN SUN</creatorcontrib><title>POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><description>According to the present invention, a window is used for detecting an end point of a polishing pad used in a polishing process when detecting the end point of the polishing process so that it is possible to prevent an error in end point detection by preventing a performance deviation of the end point detection due to a laser difference of a polishing apparatus. In addition, it is possible to provide a method of manufacturing a semiconductor device to which the polishing pad is applied. In the window, the absorbance gradient uniformity index (ACU) expressed as ACU = (Ax + Ay)/Az may be 1.5 to 2.5. 본 발명은 연마 공정에 사용되는 연마패드의 종점 검출용 윈도우로, 연마 공정의 종점 검출 시, 연마 장치의 레이저 차이로 인한 종점 검출의 성능 편차 발생을 방지하여 종점 검출의 오류를 방지할 수 있다. 또한, 상기 연마 패드를 적용한 반도체 소자의 제조 방법을 제공할 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNysEKAiEUQFE3LaL6hwetA1FwL_ompfSJOm2HIWw1TAPT_xMDfUCrC5ezZz7R3Rfn4xWStqCjhZQx6bydgNWRBeqgYPCGou1NpQwWH94g9GVD1SEUHfDIdq9xWtvp1wM7d1iNu7TlPbR1GZ9tbp_hlgUXgnMplVJa_qe-yFottw</recordid><startdate>20220317</startdate><enddate>20220317</enddate><creator>YUN JONG UK</creator><creator>SEO JANG WON</creator><creator>JOENG EUN SUN</creator><scope>EVB</scope></search><sort><creationdate>20220317</creationdate><title>POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><author>YUN JONG UK ; SEO JANG WON ; JOENG EUN SUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20220033666A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YUN JONG UK</creatorcontrib><creatorcontrib>SEO JANG WON</creatorcontrib><creatorcontrib>JOENG EUN SUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUN JONG UK</au><au>SEO JANG WON</au><au>JOENG EUN SUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><date>2022-03-17</date><risdate>2022</risdate><abstract>According to the present invention, a window is used for detecting an end point of a polishing pad used in a polishing process when detecting the end point of the polishing process so that it is possible to prevent an error in end point detection by preventing a performance deviation of the end point detection due to a laser difference of a polishing apparatus. In addition, it is possible to provide a method of manufacturing a semiconductor device to which the polishing pad is applied. In the window, the absorbance gradient uniformity index (ACU) expressed as ACU = (Ax + Ay)/Az may be 1.5 to 2.5. 본 발명은 연마 공정에 사용되는 연마패드의 종점 검출용 윈도우로, 연마 공정의 종점 검출 시, 연마 장치의 레이저 차이로 인한 종점 검출의 성능 편차 발생을 방지하여 종점 검출의 오류를 방지할 수 있다. 또한, 상기 연마 패드를 적용한 반도체 소자의 제조 방법을 제공할 수 있다.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
title	POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
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