POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

According to the present invention, a window is used for detecting an end point of a polishing pad used in a polishing process when detecting the end point of the polishing process so that it is possible to prevent an error in end point detection by preventing a performance deviation of the end poin...

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Hauptverfasser: YUN JONG UK, SEO JANG WON, JOENG EUN SUN
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:According to the present invention, a window is used for detecting an end point of a polishing pad used in a polishing process when detecting the end point of the polishing process so that it is possible to prevent an error in end point detection by preventing a performance deviation of the end point detection due to a laser difference of a polishing apparatus. In addition, it is possible to provide a method of manufacturing a semiconductor device to which the polishing pad is applied. In the window, the absorbance gradient uniformity index (ACU) expressed as ACU = (Ax + Ay)/Az may be 1.5 to 2.5. 본 발명은 연마 공정에 사용되는 연마패드의 종점 검출용 윈도우로, 연마 공정의 종점 검출 시, 연마 장치의 레이저 차이로 인한 종점 검출의 성능 편차 발생을 방지하여 종점 검출의 오류를 방지할 수 있다. 또한, 상기 연마 패드를 적용한 반도체 소자의 제조 방법을 제공할 수 있다.