SEMICONDUCTOR PACKAGE

The present invention provides a semiconductor package capable of exhibiting improved electrical and mechanical performance. The semiconductor package includes a redistribution substrate including a redistribution pattern, a semiconductor chip mounted on a top surface of the redistribution substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AN JIN HO, JEONG TEAHWA, FUJISAKI ATSUSHI, BAE SEONG HOON, KANG GYUHO, CHOI JU IL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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