POLISHING PAD MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

The present invention includes a polishing layer having a chemical bond structure and a cross-linked structure corresponding to a GPC measurement value of a processing composition obtained by treating the polishing layer of a polishing pad under a predetermined condition, such that a polishing surfa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YUN JONG UK, JEONG YONG JU, SEO JANG WON, JOENG EUN SUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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