Polyimide precursor its solution polyimide film manufacturing method thereof and use thereof

The present invention relates to a polyimide precursor, a polyimide precursor solution, a polyimide film, a preparation method thereof, and a use thereof. The polyimide precursor of the present invention can provide the polyimide film which has an excellent heat resistance and satisfies transparency...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG MINSEON, LEE JOOHYUN, KWAK HYOSHIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a polyimide precursor, a polyimide precursor solution, a polyimide film, a preparation method thereof, and a use thereof. The polyimide precursor of the present invention can provide the polyimide film which has an excellent heat resistance and satisfies transparency and a low coefficient of linear thermal expansion and thus will be usefully applicable to the field of a flexible display which requires high dimensional stability. 본 발명은 폴리이미드 전구체, 폴리이미드 전구체 용액, 폴리이미드 필름, 이의 제조방법 및 이의 용도에 관한 것으로, 본 발명의 폴리이미드 전구체는 내열성이 우수하고, 투명성 및 저선열팽창계수를 만족하는 폴리이미드 필름을 제공할 수 있어 높은 치수 안정성이 요구되는 플렉시블 디스플레이 분야 등에서 유용하게 적용 가능할 것이다.