Semiconductor Package

One technical object to be solved by the present invention is to provide a semiconductor package capable of blocking electromagnetic interference to the outside of the package. The present invention relates to a semiconductor package. Specifically, the semiconductor package comprises: a substrate co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OH JUHYEON, LEE YONGKWAN, KOH KYONG HWAN, KIM JONGWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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