PHOTOSENSITIVE RESIN COMPOSITION PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME

Provided are a photosensitive resin composition including: (A) a polyhydroxyamide-based resin including a structural unit represented by chemical formula 1, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent; a photosensitive resin film produced by using the sa...

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Bibliographische Detailangaben
Hauptverfasser:	KO JINTAE, BAEK TAEK JIN, KANG JINHEE, KIM SANG SOO, KIM DO UK, HONG CHUNGBEUM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided are a photosensitive resin composition including: (A) a polyhydroxyamide-based resin including a structural unit represented by chemical formula 1, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent; a photosensitive resin film produced by using the same; and a semiconductor device including the photosensitive resin film. In chemical formula 1, each substituent is the same as defined in the specification. According to the present invention, an insulation film for a semiconductor rewiring layer with excellent heat resistance and reliability can be implemented. (A) 하기 화학식 1로 표시되는 구조단위를 포함하는 폴리하이드록시아미드계 수지; (B) 광중합성 화합물; (C) 광중합 개시제; 및 (D) 용매를 포함하는 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자가 제공된다. [화학식 1] JPEGpat00050.jpg56149 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)