CONDUCTUIVE CONNECT COMPOSITION AND ELECTRONIC MEMNER

A conductive bonding composition according to an embodiment includes metal particle and an organic vehicle. The metal particle includes first particle and second particle. A melting point of the first particle is greater than a melting point of the second particle, and at least one of the first part...

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Bibliographische Detailangaben
Hauptverfasser:	JOONGNYON KIM, GUKHWAN AN, JINWON CHUNG, SUNGJIN YUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A conductive bonding composition according to an embodiment includes metal particle and an organic vehicle. The metal particle includes first particle and second particle. A melting point of the first particle is greater than a melting point of the second particle, and at least one of the first particle and the second particle includes particles having different particle diameters. The weight% ratio of the first particle to the second particle is 4:6 to 7:3. 실시예에 따른 전도성 접합 조성물은, 금속 입자 및 유기 비히클을 포함하고, 상기 금속 입자는 제 1 입자 및 제 2 입자를 포함하고, 상기 제 1 입자의 융점은 상기 제 2 입자의 융점보다 크고, 상기 제 1 입자 및 상기 제 2 입자 중 적어도 하나의 입자는 서로 다른 입경을 가지는 입자들을 포함하고, 상기 제 1 입자와 상기 제 2 입자의 중량%비는 4:6 내지 7:3이다.