FPCB Bonding Apparatus for FPCB

The present invention relates to a welding device capable of bonding an FPCB. The present invention comprises: a rotating index plate; support units respectively provided at a plurality of positions formed at predetermined intervals on the index plate; and a bonding unit lifted toward the support un...

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Bibliographische Detailangaben
Hauptverfasser:	PARK SUNG CHOL, JUNG YOUN KAP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a welding device capable of bonding an FPCB. The present invention comprises: a rotating index plate; support units respectively provided at a plurality of positions formed at predetermined intervals on the index plate; and a bonding unit lifted toward the support units and performing a bonding process of the FPCB. 본 발명은 FPCB를 본딩할 수 있는 가접 장치에 관한 것이다. 본 발명은 회전하는 인덱스 판; 상기 인덱스 판상에 소정의 간격을 두고 형성되는 복수의 포지션에 각각 마련되는 지지 유니트; 상기 지지 유니트를 향해 승강하고 FPCB의 본딩 공정을 수행하는 본딩 유니트를 포함하는 FPCB 가접 장치가 제공될 수 있다.