RESIN MOLDING EQUIPMENT AND MANUFACTURING METHOD OF RESIN MOLDED PRODUCTS

The purpose of the present invention is to provide a resin molding device which can suppress the occurrence of a problem related to resin filling. The resin molding device comprises: a mod forming a cavity; a port provided in the mold, capable of accommodating a resin material, and having an opening...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YASUI HAYATO, ONISHI YOHEI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a resin molding device which can suppress the occurrence of a problem related to resin filling. The resin molding device comprises: a mod forming a cavity; a port provided in the mold, capable of accommodating a resin material, and having an opening unit directly opened to the cavity; and a plunger which is provided so that the inside of the port can be slidably moved and extrudes the resin material accommodated in the port to transfer the resin material toward the cavity through the opening unit, wherein the inner diameter of the opening unit is the same as the outer diameter of the plunger or is formed to be larger than the outer diameter of the plunger. 본 발명은 수지 충전에 관한 문제의 발생을 억제하는 것이 가능한 수지 성형 장치를 제공하는 것을 과제로 한다. 캐비티를 형성하는 성형형과, 상기 성형형에 마련되고, 수지 재료를 수용 가능하고, 상기 캐비티에 대하여 직접적으로 개구하는 개구부가 형성된 포트와, 상기 포트 내를 미끄럼 이동 가능하게 되도록 마련되고, 상기 포트에 수용된 수지 재료를 압출함으로써, 상기 개구부를 통하여 수지 재료를, 상기 캐비티를 향하여 이송하는 플런저를 구비하고, 상기 개구부의 내경은, 상기 플런저의 외경과 동일하거나, 또는 상기 플런저의 외경보다도 크게 형성되어 있다.