IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDING THE SAME

An object of the present invention is to provide an image sensor package having a minimized area and thickness, and an image sensor module comprising the same. The image sensor package comprises: an image sensor chip that converts light collected from the outside into an electrical signal; a package...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JO CHA JEA, KWON OH GUK, YEON SEUNG HOON, KIM HYO EUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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