MEMS MEMS microphone and method of manufacturing the same

The present invention relates to a highly sensitive MEMS microphone and a method for manufacturing the same. The MEMS microphone according to an embodiment of the present invention includes: a substrate which has a through part formed in a central part; a vibrating film which has a concave-convex st...

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Bibliographische Detailangaben
Hauptverfasser:	YANG SANG HYEOK, KIM HYUN SOO, YOO IL SEON, KIM DONG GU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PUBLIC ADDRESS SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a highly sensitive MEMS microphone and a method for manufacturing the same. The MEMS microphone according to an embodiment of the present invention includes: a substrate which has a through part formed in a central part; a vibrating film which has a concave-convex structure formed on an upper portion of the through part in an upper portion of the substrate; and a fixed film which is deposited on an upper position spaced apart from the vibrating film of the concave-convex structure by a predetermined distance. 본 발명은 고감도 MEMS 마이크로폰 및 그 제조방법에 관한 것으로, 본 발명의 일 실시 예에 따른 MEMS 마이크로폰은 중앙부에 관통부가 형성되는 기판; 상기 기판 상부에 관통부 상부에 형성되는 요철 구조의 진동막; 상기 요철 구조의 진동막과 일정 간격 이격된 상부 위치에 증착된 고정막을 포함할 수 있다. 본 발명의 일 실시 예에 따른 MEMS 마이크로폰은 중앙부에 관통부가 형성되는 기판; 상기 기판 상부에 관통부 상부에 형성되는 요철 구조의 진동막; 상기 요철 구조의 진동막과 일정 간격 이격된 상부 위치에 증착된 고정막을 포함할 수 있다.