DISPLAY DEVICE AND MANUFACTURING METHOD FOR THE SAME

A display device of one embodiment of the present invention comprises: a display panel including a plurality of panel pads; a flexible circuit board including a plurality of connection pads corresponding to the panel pads; and a junction layer disposed between the display panel and the flexible circ...

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Bibliographische Detailangaben
Hauptverfasser:	WOO HEEJU, JANG JOO NYUNG, KIM GANA, YEO SOYOUNG, JEONG SUN OH
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A display device of one embodiment of the present invention comprises: a display panel including a plurality of panel pads; a flexible circuit board including a plurality of connection pads corresponding to the panel pads; and a junction layer disposed between the display panel and the flexible circuit board. The junction layer comprises: a conductive unit disposed on the panel pads and including a first base unit and a plurality of conductive particles dispersed on the first base unit; and a non-conductive unit disposed between the connection pads on an upper side of the conductive unit and including a second base unit but no conductive particles. Accordingly, the present invention can present improved reliability. 일 실시예의 표시 장치는 복수 개의 패널패드들을 포함하는 표시 패널, 패널패드들에 대응하는 복수 개의 접속패드들을 포함하는 연성회로기판, 및 표시 패널과 연성회로기판 사이에 배치된 접합층을 포함하고, 접합층은 패널패드들 상에 배치되고, 제1 베이스부 및 상기 제1 베이스부에 분산된 복수 개의 도전입자들을 포함하는 도전부, 및 도전부 상측에서 접속패드들 사이에 배치되고, 제2 베이스부를 포함하고 도전입자들을 미포함하는 비도전부를 포함하여 개선된 신뢰성을 나타낼 수 있다.