Substrate processing apparatus

The present invention relates to a substrate processing device. More specifically, the present invention relates to the substrate processing device that can be used stably even when a substrate is enlarged and can provide a plasma with an improved uniformity to a processing surface of the substrate....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JEONG HONG KI, JANG WOO YEONG, LEE JAE SEUNG, KIM JUN HO
Format: Patent
Sprache:eng ; kor
Schlagworte:
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