DEPOSITION DEVICE

According to one embodiment of the present invention, the deposition apparatus comprises: a housing; a nozzle which is placed on the housing and has a first nozzle hole and a second nozzle hole adjacent to the first nozzle hole; a crucible which is placed on the housing and has a first crucible cont...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK SUNGJONG, KANG HYUNGYU, HAN JONGBUN, SEO DONGKIUN, HAN SANGJIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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