HYBRID STRUCTURE INCLUDING METAL THIN FILM LAYER COATED ON SURFACE OF CONDUCTIVE POLYMER STRUCTURE AND METHOD OF PREPARING THE SAME
The present application relates to a hybrid structure comprising a metal thin film layer coated on the surface of a conductive polymer structure, and a method for preparing the same. According to the present invention, the method for preparing a hybrid structure comprises: (a) forming a conductive p...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present application relates to a hybrid structure comprising a metal thin film layer coated on the surface of a conductive polymer structure, and a method for preparing the same. According to the present invention, the method for preparing a hybrid structure comprises: (a) forming a conductive polymer structure; (b) performing primary reduction of a metal precursor by stirring a solution containing the conductive polymer structure, the metal precursor, a first reducing agent, and a dispersion solvent; and (c) obtaining a hybrid structure including a metal thin film layer coated on the surface of the conductive polymer structure by coating the metal on the surface of the conductive polymer structure by secondary reduction of the primarily reduced metal precursor using a second reducing agent.
본원은, 전도성 고분자 구조체 표면에 코팅된 금속 박막 층을 포함하는, 하이브리드 구조체, 및 이의 제조 방법에 관한 것이다. |
---|