Composite aluminum alloy plates as electronic product cases and manufacturing method thereof
The present invention relates to an aluminum alloy composite plate for a case of an electronic product and a manufacturing method thereof. The aluminum alloy composite plate in accordance with the present invention comprises a first aluminum alloy plate and a second aluminum alloy plate stacked on e...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to an aluminum alloy composite plate for a case of an electronic product and a manufacturing method thereof. The aluminum alloy composite plate in accordance with the present invention comprises a first aluminum alloy plate and a second aluminum alloy plate stacked on each other to make a composite, wherein the first aluminum alloy plate and the second aluminum alloy plate are stacked on each other to make a composite through a hot rolling method, thereby producing a three-layered aluminum alloy composite plate and then the aluminum alloy composite plate is rolled through a cold rolling method such that the aluminum alloy composite plate is rolled to achieve the desired thickness. Then, the aluminum alloy composite plate having excellent punching and formation performance is manufactured through a T quenching and tempering method and an anodic oxidation method, wherein the first aluminum alloy plate is an intermediate layer of the aluminum alloy composite plate to provide mechanical strength necessary for a case of an electronic product and the second aluminum alloy plate is the outer layer of the aluminum alloy composite plate and is suitable for an anodic oxidation and dying process to meet the need for an aesthetic appearance of a case of an electronic product.
본 발명은 전자제품 케이스용 복합 알루미늄 합금판 및 그 제조방법에 관한 것으로서, 상기 복합 알루미늄 합금판은 서로 적층 복합되는 제1 알루미늄 합금판 및 제2 알루미늄 합금판을 포함하여 구성되되, 그 중, 제1 알루미늄 합금판 및 제2 알루미늄 합금판은 열간 압연 공법을 통하여 상호 적층 복합되어 3층 구조를 가진 복합 알루미늄 합금판을 구성한 다음 상기 복합 알루미늄 합금판을 냉간 압연 공법을 통하여 두꺼운 상태에서 엷은 상태로 필요한 두께까지 압연하고, 이어서 T 조질 처리 공법 및 양극 산화 처리 공법을 통하여 양호한 펀칭 성형 성능을 가진 복합 알루미늄 합금판으로 제조하며, 제1 알루미늄 합금판은 복합 알루미늄 합금판의 중간층으로서 전자제품 케이스에 필요한 기계적 강도를 제공하고, 제2 알루미늄 합금판은 복합 알루미늄 합금판의 외곽층으로서 양극 산화 및 염색 처리에 적합하여 전자제품 케이스의 외관 미화 요구를 만족시킬 수 있다. |
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