SUBSTRATE ASSEMBLY APPARATUS AND SUBSTRATE ASSEMBLY METHOD

Provided are a substrate assembly apparatus and substrate assembly method capable of reducing warpage of a substrate. The substrate assembly apparatus (1) is a substrate assembly apparatus that supports one side of a substrate on a lower table (10) and supports the other side of the substrate on an...

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Bibliographische Detailangaben
Hauptverfasser:	SAITO MASAYUKI, MANABE HITOSHI, KAIZU TAKUYA, ICHIMURA HISASHI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided are a substrate assembly apparatus and substrate assembly method capable of reducing warpage of a substrate. The substrate assembly apparatus (1) is a substrate assembly apparatus that supports one side of a substrate on a lower table (10) and supports the other side of the substrate on an upper table (9) to face the one side of the substrate, and performs bonding in a vacuum chamber using an adhesive provided on one side of the substrate, wherein a surface supporting the substrate of the lower table (10) has a sparsely disposed first lifter and a densely disposed second lifter, the substrate is raised by a predetermined amount by the second lifter, and then the substrate is further raised by the first lifter. The surface supporting the substrate of the upper table (9) and/or the lower table (10) has a plurality of convex portions and concave portions disposed adjacent to each other, and a width of the concave portion is a ratio of 10^(-6) to 10^(-5) relative to a width of the upper table (9) and/or the lower table (10). [과제] 기판의 휨을 저감할 수 있는 기판 조립 장치 및 기판 조립 방법을 제공한다. [해결 수단] 기판 조립 장치(1)는, 일방의 기판을 하측 테이블(10) 상에 보지하고, 타방의 기판을 상측 테이블(9)에 상기 일방의 기판에 대향시켜 보지하며, 어느 일방의 기판에 마련한 접착제에 의해 진공 챔버 내에서 접합을 행하는 기판 조립 장치로서, 하측 테이블(10)의 기판을 보지하는 면에, 성기게 배치되는 제 1 리프터와 조밀하게 배치되는 제 2 리프터를 가지고, 제 2 리프터에 의해 기판을 소정량 상승시킨 후, 제 1 리프터에 의해 기판을 더 상승시킨다. 상측 테이블(9) 및/또는 하측 테이블(10)의 기판을 보지하는 면에, 서로 인접 배치되는 복수의 볼록부 및 오목부를 가지고, 상기 오목부의 폭이 상측 테이블(9) 및/또는 하측 테이블(10)의 폭에 대하여, 10-6 내지 10-5의 비율이 된다.