ADHESIVE COMPOSTION COVERLAY FILM AND PRINTED CIRCUIT BOARD COMPRISING THE SAME

The present invention relates to an adhesive composition, a coverlay film including the same, and a printed circuit board, wherein the adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and two or more kinds of rubber. 본 발명은 접착 조성물 및 이...

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Bibliographische Detailangaben
Hauptverfasser:	RYU EUIDOCK, JEONG INKI, PARK SUBYUNG, PARK KWANGSEOK, CHAE DONGHO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive composition, a coverlay film including the same, and a printed circuit board, wherein the adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and two or more kinds of rubber. 본 발명은 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판에 관한 것으로서, 상기 접착 조성물은 (a) 에폭시 수지; 및 (b) 에폭시화 폴리부타디엔 고무, 및 2종 이상의 고무를 함유하는 바인더 수지;를 포함한다.