언더필재, 반도체 패키지 및 반도체 패키지의 제조 방법

언더필재(underfill material)는, 에폭시 수지와, 고무 성분을 포함하며, 상기 에폭시 수지가, 1분자 중에 2개의 에폭시기를 갖고, 분자량이 650 이하이고, 또한 상기 에폭시기 이외의 고리(環) 구조를 포함하지 않는 에폭시 화합물을 포함한다. This underfill material contains an epoxy resin and a rubber component; and the epoxy resin contains an epoxy compound that has two epoxy groups in each mo...

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Bibliographische Detailangaben
Hauptverfasser:	HIRAI TOMOKI, HORI KOHJI, SEKI KOHEI
Format:	Patent
Sprache:	kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	언더필재(underfill material)는, 에폭시 수지와, 고무 성분을 포함하며, 상기 에폭시 수지가, 1분자 중에 2개의 에폭시기를 갖고, 분자량이 650 이하이고, 또한 상기 에폭시기 이외의 고리(環) 구조를 포함하지 않는 에폭시 화합물을 포함한다. This underfill material contains an epoxy resin and a rubber component; and the epoxy resin contains an epoxy compound that has two epoxy groups in each molecule, but does not contain a ring structure other than the epoxy groups, while having a molecular weight of 650 or less.