Ink Composition and Thermoelectric Module Manufactured Using The Same
The present invention relates to an ink composition to remove a process for fixing a thermoelectric module on a substrate and a thermoelectric module manufactured thereby. According to the present invention, the ink composition comprises powder for a thermoelectric semiconductor device and a first b...
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| creator | KIM YOON JIN KIM YOUNG SUN KIM BYUNG WOOK LEE MIN JAE LEE HOO DAM |
| description | The present invention relates to an ink composition to remove a process for fixing a thermoelectric module on a substrate and a thermoelectric module manufactured thereby. According to the present invention, the ink composition comprises powder for a thermoelectric semiconductor device and a first binder resin including a polyisocyanate resin. A method of manufacturing a thermoelectric module comprises the following steps: forming a plurality of electrodes on a lower substrate; forming a thermoelectric material by using the ink composition so that the plurality of electrodes are connected; optically sintering the thermoelectric material; and laminating an upper substrate to face the lower substrate after optical sintering. The thermoelectric module comprises: a lower substrate; a plurality of electrodes formed on the lower substrate; a thermoelectric material formed to connect each of the plurality of electrodes by using the ink composition; and an upper substrate provided to face the lower substrate.
본 발명은 열전반도체 소자용 분말; 및 폴리이소시아네이트 수지를 포함하는 제1 바인더 수지;를 포함하는 것인 잉크 조성물, 하부기판 상에 복수의 전극을 형성하는 단계; 상기 복수의 전극이 각각 연결되도록 상기 잉크 조성물을 이용하여 열전소재를 형성하는 단계; 상기 열전소재를 광 소결하는 단계; 및 상기 광 소결 후에 상기 하부기판에 대향되도록 상부기판을 합지하는 단계;를 포함하는 것인 열전모듈의 제조 방법, 및 하부기판; 상기 하부기판 상에 형성된 복수의 전극; 상기 잉크 조성물을 이용하여 상기 복수의 전극의 각각을 연결하도록 형성된 열전소재; 및 상기 하부기판에 대향되도록 구비된 상부기판;을 포함하는 것인 열전모듈에 관한 것이다. |
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본 발명은 열전반도체 소자용 분말; 및 폴리이소시아네이트 수지를 포함하는 제1 바인더 수지;를 포함하는 것인 잉크 조성물, 하부기판 상에 복수의 전극을 형성하는 단계; 상기 복수의 전극이 각각 연결되도록 상기 잉크 조성물을 이용하여 열전소재를 형성하는 단계; 상기 열전소재를 광 소결하는 단계; 및 상기 광 소결 후에 상기 하부기판에 대향되도록 상부기판을 합지하는 단계;를 포함하는 것인 열전모듈의 제조 방법, 및 하부기판; 상기 하부기판 상에 형성된 복수의 전극; 상기 잉크 조성물을 이용하여 상기 복수의 전극의 각각을 연결하도록 형성된 열전소재; 및 상기 하부기판에 대향되도록 구비된 상부기판;을 포함하는 것인 열전모듈에 관한 것이다.</description><language>eng ; kor</language><subject>ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210802&DB=EPODOC&CC=KR&NR=20210095441A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210802&DB=EPODOC&CC=KR&NR=20210095441A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM YOON JIN</creatorcontrib><creatorcontrib>KIM YOUNG SUN</creatorcontrib><creatorcontrib>KIM BYUNG WOOK</creatorcontrib><creatorcontrib>LEE MIN JAE</creatorcontrib><creatorcontrib>LEE HOO DAM</creatorcontrib><title>Ink Composition and Thermoelectric Module Manufactured Using The Same</title><description>The present invention relates to an ink composition to remove a process for fixing a thermoelectric module on a substrate and a thermoelectric module manufactured thereby. According to the present invention, the ink composition comprises powder for a thermoelectric semiconductor device and a first binder resin including a polyisocyanate resin. A method of manufacturing a thermoelectric module comprises the following steps: forming a plurality of electrodes on a lower substrate; forming a thermoelectric material by using the ink composition so that the plurality of electrodes are connected; optically sintering the thermoelectric material; and laminating an upper substrate to face the lower substrate after optical sintering. The thermoelectric module comprises: a lower substrate; a plurality of electrodes formed on the lower substrate; a thermoelectric material formed to connect each of the plurality of electrodes by using the ink composition; and an upper substrate provided to face the lower substrate.
본 발명은 열전반도체 소자용 분말; 및 폴리이소시아네이트 수지를 포함하는 제1 바인더 수지;를 포함하는 것인 잉크 조성물, 하부기판 상에 복수의 전극을 형성하는 단계; 상기 복수의 전극이 각각 연결되도록 상기 잉크 조성물을 이용하여 열전소재를 형성하는 단계; 상기 열전소재를 광 소결하는 단계; 및 상기 광 소결 후에 상기 하부기판에 대향되도록 상부기판을 합지하는 단계;를 포함하는 것인 열전모듈의 제조 방법, 및 하부기판; 상기 하부기판 상에 형성된 복수의 전극; 상기 잉크 조성물을 이용하여 상기 복수의 전극의 각각을 연결하도록 형성된 열전소재; 및 상기 하부기판에 대향되도록 구비된 상부기판;을 포함하는 것인 열전모듈에 관한 것이다.</description><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1zMtWcM7PLcgvzizJzM9TSMxLUQjJSC3KzU_NSU0uKcpMVvDNTynNSVXwTcwrTUtMLiktSk1RCC3OzEsHKVQITsxN5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGhgYGlqYmJoaOxsSpAgCP2jOV</recordid><startdate>20210802</startdate><enddate>20210802</enddate><creator>KIM YOON JIN</creator><creator>KIM YOUNG SUN</creator><creator>KIM BYUNG WOOK</creator><creator>LEE MIN JAE</creator><creator>LEE HOO DAM</creator><scope>EVB</scope></search><sort><creationdate>20210802</creationdate><title>Ink Composition and Thermoelectric Module Manufactured Using The Same</title><author>KIM YOON JIN ; KIM YOUNG SUN ; KIM BYUNG WOOK ; LEE MIN JAE ; LEE HOO DAM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20210095441A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2021</creationdate><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM YOON JIN</creatorcontrib><creatorcontrib>KIM YOUNG SUN</creatorcontrib><creatorcontrib>KIM BYUNG WOOK</creatorcontrib><creatorcontrib>LEE MIN JAE</creatorcontrib><creatorcontrib>LEE HOO DAM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM YOON JIN</au><au>KIM YOUNG SUN</au><au>KIM BYUNG WOOK</au><au>LEE MIN JAE</au><au>LEE HOO DAM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ink Composition and Thermoelectric Module Manufactured Using The Same</title><date>2021-08-02</date><risdate>2021</risdate><abstract>The present invention relates to an ink composition to remove a process for fixing a thermoelectric module on a substrate and a thermoelectric module manufactured thereby. According to the present invention, the ink composition comprises powder for a thermoelectric semiconductor device and a first binder resin including a polyisocyanate resin. A method of manufacturing a thermoelectric module comprises the following steps: forming a plurality of electrodes on a lower substrate; forming a thermoelectric material by using the ink composition so that the plurality of electrodes are connected; optically sintering the thermoelectric material; and laminating an upper substrate to face the lower substrate after optical sintering. The thermoelectric module comprises: a lower substrate; a plurality of electrodes formed on the lower substrate; a thermoelectric material formed to connect each of the plurality of electrodes by using the ink composition; and an upper substrate provided to face the lower substrate.
본 발명은 열전반도체 소자용 분말; 및 폴리이소시아네이트 수지를 포함하는 제1 바인더 수지;를 포함하는 것인 잉크 조성물, 하부기판 상에 복수의 전극을 형성하는 단계; 상기 복수의 전극이 각각 연결되도록 상기 잉크 조성물을 이용하여 열전소재를 형성하는 단계; 상기 열전소재를 광 소결하는 단계; 및 상기 광 소결 후에 상기 하부기판에 대향되도록 상부기판을 합지하는 단계;를 포함하는 것인 열전모듈의 제조 방법, 및 하부기판; 상기 하부기판 상에 형성된 복수의 전극; 상기 잉크 조성물을 이용하여 상기 복수의 전극의 각각을 연결하도록 형성된 열전소재; 및 상기 하부기판에 대향되도록 구비된 상부기판;을 포함하는 것인 열전모듈에 관한 것이다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Ink Composition and Thermoelectric Module Manufactured Using The Same |
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