BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION

A bonding device includes a holding element, a retaining element actuator, a sensor, a controller, and a bonding force adjusting actuator. In use, the retaining element retains an electrical component and is moved by the retaining element actuator in one or more operating directions to contact the e...

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Bibliographische Detailangaben
Hauptverfasser:	WAN MING YEUNG, CHEUNG YU FU, CHEUNG WAI KIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A bonding device includes a holding element, a retaining element actuator, a sensor, a controller, and a bonding force adjusting actuator. In use, the retaining element retains an electrical component and is moved by the retaining element actuator in one or more operating directions to contact the electrical component with a base member. The sensor measures a reaction force exerted on the retaining element in response to a contact between the electrical component and the base member. The controller determines a bonding force to be exerted on an operating region of the retaining element during a bonding process based on the measured reaction force. The bonding force adjusting actuator exerts this bonding force on the operating region of the retaining element during the bonding process so as to adjust an inclination of the electrical component for the base member. 접합 장치는 유지 요소, 유지 요소 액추에이터, 센서, 제어기 및 접합력 조정 액추에이터를 포함한다. 사용시, 유지 요소는 전기 구성요소를 유지하고 유지 요소 액추에이터에 의해 하나 이상의 작동 방향으로 이동되어 전기 구성요소를 베이스 부재와 접촉시킨다. 센서는 전기 구성요소와 베이스 부재 사이의 접촉에 반응하여 유지 요소에 발휘되는 반력을 측정한다. 제어기는 측정된 반력에 기초하여 접합 공정 중에 유지 요소의 작동 영역에 발휘될 접합력을 결정하고, 접합력 조정 액추에이터는 접합 공정 중에 유지 요소의 작동 영역에 이러한 접합력을 발휘하여 베이스 부재에 대한 전기 구성요소의 기울기를 조정한다.