RESIN COMPOSITION RESIN FILM AND METAL CLAD LAMINATE

Provided are a resin composition and a resin film capable of responding to the high frequency of electronic devices by further improving the dielectric properties of a resin film using polyimide as a raw material. More specifically, the present invention relates to a resin composition which contains...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANAKA MUTSUHITO, FUJI MAITO, DEAI HIROYUKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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