SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

According to an embodiment of the present invention, a semiconductor device manufacturing method includes the following steps of: forming a first stacked structure including first interlayer insulating layers and first horizontal sacrificial layers alternately and repeatedly stacked on a substrate;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK BYUNG GON, CHEON JI SUNG, CHOI JUN YOUNG, LIM JIN SOO, HONG SUK BUM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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