MULTI-LAYERED ELECTRONIC COMPONENT

Provided, in one aspect of the present invention, is a stacked electronic component comprising: a body comprising a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the external electrode comprises an electrode layer comprising Cu and comprising one...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HONG JONG CHEOL, LEE CHANG BAE, YANG SI JOONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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Beschreibung
Zusammenfassung:	Provided, in one aspect of the present invention, is a stacked electronic component comprising: a body comprising a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein the external electrode comprises an electrode layer comprising Cu and comprising one or more additional element among Ni, Zn, and Co and connected to the inner electrode, a reaction layer disposed on the electrode layer and comprising a Cu-Sn-based intermetallic compound, and a solder layer disposed on the reaction layer and comprising an Sn-based solder. Therefore, the present invention is capable of improving a reliability of the stacked electronic component. 본 발명의 일 측면은 유전체층 및 내부 전극을 포함하는 바디; 및 상기 바디에 배치되는 외부 전극;을 포함하고, 상기 외부 전극은, Cu를 포함하며, Ni, Zn 및 Co 중 하나 이상의 추가 원소를 포함하고 상기 내부 전극과 연결된 전극층, 상기 전극층 상에 배치되며 Cu-Sn계 금속간 화합물을 포함하는 반응층, 및 상기 반응층 상에 배치되며 Sn계 솔더를 포함하는 솔더층을 포함하는 적층형 전자 부품을 제공한다.