Laser processing apparatus and laser processing method

An objective of the present invention is to allow a focus of a laser irradiation system to be changed at high-speed, and to enable high-quality and high-efficiency processing. In a laser processing device for processing by irradiating the laser pulse to a workpiece by being configured with a laser o...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YUKI SAEKI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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