Insulating film composition for forming a semiconductor device
In the present invention, provided is an insulating film composition for a semiconductor, which contains: a polyimide resin represented by chemical formula 1; and an organic solvent. In the chemical formula 1, each substituent is the same as defined in a specification. The insulating film compositio...
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| creator | BAEK TAEK JIN KANG JINHEE KIM SANG SOO KIM DO UK RYU JEEHYUN HONG CHUNGBEUM |
| description | In the present invention, provided is an insulating film composition for a semiconductor, which contains: a polyimide resin represented by chemical formula 1; and an organic solvent. In the chemical formula 1, each substituent is the same as defined in a specification. The insulating film composition for the semiconductor has excellent chemical resistance.
본 발명에서는 하기 화학식 1로 표시되는 폴리이미드 수지; 및 유기 용매를 포함하는 반도체용 절연막 조성물이 제공된다. [화학식 1] JPEGpat00061.jpg42133 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.) |
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본 발명에서는 하기 화학식 1로 표시되는 폴리이미드 수지; 및 유기 용매를 포함하는 반도체용 절연막 조성물이 제공된다. [화학식 1] JPEGpat00061.jpg42133 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</description><language>eng ; kor</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210624&DB=EPODOC&CC=KR&NR=20210076739A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210624&DB=EPODOC&CC=KR&NR=20210076739A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAEK TAEK JIN</creatorcontrib><creatorcontrib>KANG JINHEE</creatorcontrib><creatorcontrib>KIM SANG SOO</creatorcontrib><creatorcontrib>KIM DO UK</creatorcontrib><creatorcontrib>RYU JEEHYUN</creatorcontrib><creatorcontrib>HONG CHUNGBEUM</creatorcontrib><title>Insulating film composition for forming a semiconductor device</title><description>In the present invention, provided is an insulating film composition for a semiconductor, which contains: a polyimide resin represented by chemical formula 1; and an organic solvent. In the chemical formula 1, each substituent is the same as defined in a specification. The insulating film composition for the semiconductor has excellent chemical resistance.
본 발명에서는 하기 화학식 1로 표시되는 폴리이미드 수지; 및 유기 용매를 포함하는 반도체용 절연막 조성물이 제공된다. [화학식 1] JPEGpat00061.jpg42133 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDzzCsuzUksycxLV0jLzMlVSM7PLcgvzizJzM9TSMsvAuFckGSiQnFqbmZyfl5KaXIJUDwltSwzOZWHgTUtMac4lRdKczMou7mGOHvophbkx6cWFyQmp-allsR7BxkZGBkaGJibmRtbOhoTpwoAWFgx7g</recordid><startdate>20210624</startdate><enddate>20210624</enddate><creator>BAEK TAEK JIN</creator><creator>KANG JINHEE</creator><creator>KIM SANG SOO</creator><creator>KIM DO UK</creator><creator>RYU JEEHYUN</creator><creator>HONG CHUNGBEUM</creator><scope>EVB</scope></search><sort><creationdate>20210624</creationdate><title>Insulating film composition for forming a semiconductor device</title><author>BAEK TAEK JIN ; KANG JINHEE ; KIM SANG SOO ; KIM DO UK ; RYU JEEHYUN ; HONG CHUNGBEUM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20210076739A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2021</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>BAEK TAEK JIN</creatorcontrib><creatorcontrib>KANG JINHEE</creatorcontrib><creatorcontrib>KIM SANG SOO</creatorcontrib><creatorcontrib>KIM DO UK</creatorcontrib><creatorcontrib>RYU JEEHYUN</creatorcontrib><creatorcontrib>HONG CHUNGBEUM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BAEK TAEK JIN</au><au>KANG JINHEE</au><au>KIM SANG SOO</au><au>KIM DO UK</au><au>RYU JEEHYUN</au><au>HONG CHUNGBEUM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Insulating film composition for forming a semiconductor device</title><date>2021-06-24</date><risdate>2021</risdate><abstract>In the present invention, provided is an insulating film composition for a semiconductor, which contains: a polyimide resin represented by chemical formula 1; and an organic solvent. In the chemical formula 1, each substituent is the same as defined in a specification. The insulating film composition for the semiconductor has excellent chemical resistance.
본 발명에서는 하기 화학식 1로 표시되는 폴리이미드 수지; 및 유기 용매를 포함하는 반도체용 절연막 조성물이 제공된다. [화학식 1] JPEGpat00061.jpg42133 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.)</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
| title | Insulating film composition for forming a semiconductor device |
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