Insulating film composition for forming a semiconductor device
In the present invention, provided is an insulating film composition for a semiconductor, which contains: a polyimide resin represented by chemical formula 1; and an organic solvent. In the chemical formula 1, each substituent is the same as defined in a specification. The insulating film compositio...
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Zusammenfassung: | In the present invention, provided is an insulating film composition for a semiconductor, which contains: a polyimide resin represented by chemical formula 1; and an organic solvent. In the chemical formula 1, each substituent is the same as defined in a specification. The insulating film composition for the semiconductor has excellent chemical resistance.
본 발명에서는 하기 화학식 1로 표시되는 폴리이미드 수지; 및 유기 용매를 포함하는 반도체용 절연막 조성물이 제공된다. [화학식 1] JPEGpat00061.jpg42133 (상기 화학식 1에서, 각 치환기는 명세서에 정의된 바와 같다.) |
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