UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAG USING THE SAME

The present invention relates to an underfill film for a semiconductor package and to a manufacturing method of a semiconductor package using the same. Provided are the underfill film for a semiconductor package including an adhesive layer with the lowest melt viscosity, and improving the connection...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK SOOIN, CHOI TAEJIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!