UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAG USING THE SAME

The present invention relates to an underfill film for a semiconductor package and to a manufacturing method of a semiconductor package using the same. Provided are the underfill film for a semiconductor package including an adhesive layer with the lowest melt viscosity, and improving the connection...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PARK SOOIN, CHOI TAEJIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	The present invention relates to an underfill film for a semiconductor package and to a manufacturing method of a semiconductor package using the same. Provided are the underfill film for a semiconductor package including an adhesive layer with the lowest melt viscosity, and improving the connection reliability of the package by minimizing the occurrence of voids during semiconductor packaging, and the manufacturing method of a semiconductor package using the same. 본 발명은 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법에 대한 것으로서, 최저 용융 점도가 낮은 접착층을 포함하여 반도체 패키징시 보이드 발생을 최소화하여 패키지의 접속 신뢰성을 향상시킬 수 있는 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법에 관한 것이다.