DISPLAY MODULE AND DISPLAY MODULE TESTING METHOD

A method for manufacturing a display device includes the steps of: providing an electronic component including a plurality of bumps; providing a first adhesive member between the plurality of bumps; providing a display panel; aligning the electronic component and the display panel; and bonding by ap...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WOO HEEJU, LEE HYUN A, LEE SANGDUK, YOUK KIKYUNG, JANG DAEHWAN, PARK CHAN JAE
Format: Patent
Sprache:eng ; kor
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WOO HEEJU
LEE HYUN A
LEE SANGDUK
YOUK KIKYUNG
JANG DAEHWAN
PARK CHAN JAE
description A method for manufacturing a display device includes the steps of: providing an electronic component including a plurality of bumps; providing a first adhesive member between the plurality of bumps; providing a display panel; aligning the electronic component and the display panel; and bonding by applying ultrasonic waves. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members. Accordingly, in the method for manufacturing the display device according to the embodiment of the present invention, a process time may be reduced and the display device having excellent conductivity between the electronic component and the display panel may be manufactured. 일 실시예의 표시 장치의 제조 방법은 복수 개의 범프들을 포함하는 전자 부품을 제공하는 단계, 상기 복수 개의 범프들 사이에 제1 접착 부재를 제공하는 단계, 표시 패널을 제공하는 단계, 상기 전자 부품 및 상기 표시 패널을 정렬하는 단계, 및 초음파를 인가하여 접합하는 단계 포함한다. 상기 제1 접착 부재를 제공하는 단계에서 상기 복수 개의 범프들 각각의 상면의 적어도 일부는 상기 제1 접착 부재 사이에서 노출된다. 따라서, 일 실시예의 표시 장치의 제조 방법은 공정 시간이 단축될 수 있고, 전자 부품과 표시 패널 간의 전도성이 뛰어난 표시 장치를 제조할 수 있다.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20210060732A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20210060732A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20210060732A3</originalsourceid><addsrcrecordid>eNrjZDBw8QwO8HGMVPD1dwn1cVVw9HNRQBMKcQ0O8fRzV_B1DfHwd-FhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGRoYGBmYG5sZGjsbEqQIAv_snCw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DISPLAY MODULE AND DISPLAY MODULE TESTING METHOD</title><source>esp@cenet</source><creator>WOO HEEJU ; LEE HYUN A ; LEE SANGDUK ; YOUK KIKYUNG ; JANG DAEHWAN ; PARK CHAN JAE</creator><creatorcontrib>WOO HEEJU ; LEE HYUN A ; LEE SANGDUK ; YOUK KIKYUNG ; JANG DAEHWAN ; PARK CHAN JAE</creatorcontrib><description>A method for manufacturing a display device includes the steps of: providing an electronic component including a plurality of bumps; providing a first adhesive member between the plurality of bumps; providing a display panel; aligning the electronic component and the display panel; and bonding by applying ultrasonic waves. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members. Accordingly, in the method for manufacturing the display device according to the embodiment of the present invention, a process time may be reduced and the display device having excellent conductivity between the electronic component and the display panel may be manufactured. 일 실시예의 표시 장치의 제조 방법은 복수 개의 범프들을 포함하는 전자 부품을 제공하는 단계, 상기 복수 개의 범프들 사이에 제1 접착 부재를 제공하는 단계, 표시 패널을 제공하는 단계, 상기 전자 부품 및 상기 표시 패널을 정렬하는 단계, 및 초음파를 인가하여 접합하는 단계 포함한다. 상기 제1 접착 부재를 제공하는 단계에서 상기 복수 개의 범프들 각각의 상면의 적어도 일부는 상기 제1 접착 부재 사이에서 노출된다. 따라서, 일 실시예의 표시 장치의 제조 방법은 공정 시간이 단축될 수 있고, 전자 부품과 표시 패널 간의 전도성이 뛰어난 표시 장치를 제조할 수 있다.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210527&amp;DB=EPODOC&amp;CC=KR&amp;NR=20210060732A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210527&amp;DB=EPODOC&amp;CC=KR&amp;NR=20210060732A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WOO HEEJU</creatorcontrib><creatorcontrib>LEE HYUN A</creatorcontrib><creatorcontrib>LEE SANGDUK</creatorcontrib><creatorcontrib>YOUK KIKYUNG</creatorcontrib><creatorcontrib>JANG DAEHWAN</creatorcontrib><creatorcontrib>PARK CHAN JAE</creatorcontrib><title>DISPLAY MODULE AND DISPLAY MODULE TESTING METHOD</title><description>A method for manufacturing a display device includes the steps of: providing an electronic component including a plurality of bumps; providing a first adhesive member between the plurality of bumps; providing a display panel; aligning the electronic component and the display panel; and bonding by applying ultrasonic waves. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members. Accordingly, in the method for manufacturing the display device according to the embodiment of the present invention, a process time may be reduced and the display device having excellent conductivity between the electronic component and the display panel may be manufactured. 일 실시예의 표시 장치의 제조 방법은 복수 개의 범프들을 포함하는 전자 부품을 제공하는 단계, 상기 복수 개의 범프들 사이에 제1 접착 부재를 제공하는 단계, 표시 패널을 제공하는 단계, 상기 전자 부품 및 상기 표시 패널을 정렬하는 단계, 및 초음파를 인가하여 접합하는 단계 포함한다. 상기 제1 접착 부재를 제공하는 단계에서 상기 복수 개의 범프들 각각의 상면의 적어도 일부는 상기 제1 접착 부재 사이에서 노출된다. 따라서, 일 실시예의 표시 장치의 제조 방법은 공정 시간이 단축될 수 있고, 전자 부품과 표시 패널 간의 전도성이 뛰어난 표시 장치를 제조할 수 있다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBw8QwO8HGMVPD1dwn1cVVw9HNRQBMKcQ0O8fRzV_B1DfHwd-FhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHeQUYGRoYGBmYG5sZGjsbEqQIAv_snCw</recordid><startdate>20210527</startdate><enddate>20210527</enddate><creator>WOO HEEJU</creator><creator>LEE HYUN A</creator><creator>LEE SANGDUK</creator><creator>YOUK KIKYUNG</creator><creator>JANG DAEHWAN</creator><creator>PARK CHAN JAE</creator><scope>EVB</scope></search><sort><creationdate>20210527</creationdate><title>DISPLAY MODULE AND DISPLAY MODULE TESTING METHOD</title><author>WOO HEEJU ; LEE HYUN A ; LEE SANGDUK ; YOUK KIKYUNG ; JANG DAEHWAN ; PARK CHAN JAE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20210060732A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>WOO HEEJU</creatorcontrib><creatorcontrib>LEE HYUN A</creatorcontrib><creatorcontrib>LEE SANGDUK</creatorcontrib><creatorcontrib>YOUK KIKYUNG</creatorcontrib><creatorcontrib>JANG DAEHWAN</creatorcontrib><creatorcontrib>PARK CHAN JAE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WOO HEEJU</au><au>LEE HYUN A</au><au>LEE SANGDUK</au><au>YOUK KIKYUNG</au><au>JANG DAEHWAN</au><au>PARK CHAN JAE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DISPLAY MODULE AND DISPLAY MODULE TESTING METHOD</title><date>2021-05-27</date><risdate>2021</risdate><abstract>A method for manufacturing a display device includes the steps of: providing an electronic component including a plurality of bumps; providing a first adhesive member between the plurality of bumps; providing a display panel; aligning the electronic component and the display panel; and bonding by applying ultrasonic waves. In providing first adhesive members, at least a portion of a top surface of each of the plurality of bumps is exposed between the first adhesive members. Accordingly, in the method for manufacturing the display device according to the embodiment of the present invention, a process time may be reduced and the display device having excellent conductivity between the electronic component and the display panel may be manufactured. 일 실시예의 표시 장치의 제조 방법은 복수 개의 범프들을 포함하는 전자 부품을 제공하는 단계, 상기 복수 개의 범프들 사이에 제1 접착 부재를 제공하는 단계, 표시 패널을 제공하는 단계, 상기 전자 부품 및 상기 표시 패널을 정렬하는 단계, 및 초음파를 인가하여 접합하는 단계 포함한다. 상기 제1 접착 부재를 제공하는 단계에서 상기 복수 개의 범프들 각각의 상면의 적어도 일부는 상기 제1 접착 부재 사이에서 노출된다. 따라서, 일 실시예의 표시 장치의 제조 방법은 공정 시간이 단축될 수 있고, 전자 부품과 표시 패널 간의 전도성이 뛰어난 표시 장치를 제조할 수 있다.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; kor
recordid cdi_epo_espacenet_KR20210060732A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
PRINTED CIRCUITS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
title DISPLAY MODULE AND DISPLAY MODULE TESTING METHOD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T10%3A49%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WOO%20HEEJU&rft.date=2021-05-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EKR20210060732A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true