BLACK PHOTOSENSITIVE COMPOSITION FOR LOW TEMPERATURE CURING BLACK LIGHT SHIELDING FILM AND DISPLAY DEVICE

The present specification relates to a low-temperature curing black photosensitive composition including: a binder resin; a polyfunctional monomer; a coloring agent; a photoinitiator; a biimidazole compound; and a solvent. Provided are a low-temperature curing black photosensitive composition, a bla...

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Bibliographische Detailangaben
Hauptverfasser:	KIM GUNTAE, CHOI DONGCHANG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present specification relates to a low-temperature curing black photosensitive composition including: a binder resin; a polyfunctional monomer; a coloring agent; a photoinitiator; a biimidazole compound; and a solvent. Provided are a low-temperature curing black photosensitive composition, a black light-shielding film formed using the same, and a display device including the black light-shielding film, wherein the binder resin includes an epoxy resin, the low-temperature curing black photosensitive composition includes 20 to 40 wt% of the biimidazole compound based on the total weight of the photoinitiator and the biimidazole compound, and the solubility of the biimidazole compound is 0.5 to 4 g based on 100 g of the solvent. 본 명세서는 바인더 수지; 다관능성 모노머; 착색제; 광개시제; 비이미다졸(biimidazole) 화합물 및 용매를 포함하는 저온 경화용 블랙 감광성 조성물로서, 상기 바인더 수지는 에폭시 수지를 포함하고, 상기 저온 경화용 블랙 감광성 조성물은 상기 광개시제 및 비이미다졸 화합물의 총 중량을 기준으로 상기 비이미다졸 화합물이 20 중량% 내지 40 중량% 포함하고, 상기 비이미다졸 화합물의 용해도는 용매 100g 기준 0.5g 내지 4g인 것인 저온 경화용 블랙 감광성 조성물, 이를 이용하여 형성된 블랙 차광막 및 상기 블랙 차광막을 포함하는 디스플레이 장치에 관한 것이다.