THERMAL CURABLE ADHESIVE COMPOSITION COMPOSITE STRUCTURE HAVING ADHESIVE LAYER AND ITS PREPARATION METHOD

The present invention relates to a thermosetting adhesive composition that has excellent adhesive strength and enables the formation of an adhesive layer that exhibits improved impact strength in a wide temperature range including low temperatures, a structure including an adhesive layer formed usin...

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Bibliographische Detailangaben
Hauptverfasser:	JUNG JAE HO, KIM DONGYONG, KO MINJIN, KIM MIN KYOUN, LEE TAEK YONG, CHO BYUNGKYU, YU MIN A
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a thermosetting adhesive composition that has excellent adhesive strength and enables the formation of an adhesive layer that exhibits improved impact strength in a wide temperature range including low temperatures, a structure including an adhesive layer formed using the same, and a method for manufacturing the same. The thermosetting adhesive composition includes: a silane-modified epoxy resin; a liquid rubber; a polyurethane resin including a polymer block derived from polytetrahydrofuran; and a thermal curing agent curable at a temperature of 80 deg. C or higher. 본 발명은 우수한 접착 강도를 가지며, 저온을 포함한 넓은 온도 범위에서 보다 향상된 충격 강도를 나타내는 접착층의 형성을 가능케 하는 열 경화성 접착제 조성물과, 이를 사용하여 형성된 접착층을 포함한 구조체 및 이의 제조 방법에 관한 것이다. 상기 열 경화성 접착제 조성물은 실란 변성 에폭시 수지; 액상 러버; 폴리테트라하이드로퓨란에서 유래한 고분자 블록을 포함한 폴리우레탄 수지; 및 80 ℃ 이상의 온도에서 경화 가능한 열 경화제를 포함한다.