METHOD FOR CONTROLLING VACUUM DEPOSITION DEVICE
The present invention relates to a control method of a vacuum deposition device, which comprises: an opening degree control process of controlling an opening degree of a first control valve and a second control valve controlling an emission amount of a deposition material; and a pressure detection p...
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| creator | MATSUMOTO YUJI SHIMIZU YUSUKE FUJIMOTO EISHI |
| description | The present invention relates to a control method of a vacuum deposition device, which comprises: an opening degree control process of controlling an opening degree of a first control valve and a second control valve controlling an emission amount of a deposition material; and a pressure detection process of obtaining a detection value of emission pressure of the deposition material. In an opening amount control process, when both sides of the first control valve and the second control valve are opened, a detection value of film thickness by a film thickness detector is used, and the detection value of the emission pressure is used when only one side is opened, thereby controlling the opening amount. The present invention increases life of the film thickness detector.
본 발명은, 증착재료의 방출량을 조정하는 제1조정밸브 및 제2조정밸브의 개방량을 조정하는 개방량 조정공정과, 증착재료의 방출압의 검출값을 취득하는 압력검출공정을 포함하는 진공증착장치의 제어방법에 관한 것으로서, 개방량 조정공정에서는, 제1조정밸브 및 제2조정밸브의 양방이 개방되어 있는 경우에 막두께 검출기에 의한 막두께의 검출값을 사용하고, 어느 일방만이 개방되어 있는 경우에 방출압의 검출값을 사용하여, 개방량을 조정한다. |
| format | Patent |
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본 발명은, 증착재료의 방출량을 조정하는 제1조정밸브 및 제2조정밸브의 개방량을 조정하는 개방량 조정공정과, 증착재료의 방출압의 검출값을 취득하는 압력검출공정을 포함하는 진공증착장치의 제어방법에 관한 것으로서, 개방량 조정공정에서는, 제1조정밸브 및 제2조정밸브의 양방이 개방되어 있는 경우에 막두께 검출기에 의한 막두께의 검출값을 사용하고, 어느 일방만이 개방되어 있는 경우에 방출압의 검출값을 사용하여, 개방량을 조정한다.</description><language>eng ; kor</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210510&DB=EPODOC&CC=KR&NR=20210052248A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210510&DB=EPODOC&CC=KR&NR=20210052248A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUMOTO YUJI</creatorcontrib><creatorcontrib>SHIMIZU YUSUKE</creatorcontrib><creatorcontrib>FUJIMOTO EISHI</creatorcontrib><title>METHOD FOR CONTROLLING VACUUM DEPOSITION DEVICE</title><description>The present invention relates to a control method of a vacuum deposition device, which comprises: an opening degree control process of controlling an opening degree of a first control valve and a second control valve controlling an emission amount of a deposition material; and a pressure detection process of obtaining a detection value of emission pressure of the deposition material. In an opening amount control process, when both sides of the first control valve and the second control valve are opened, a detection value of film thickness by a film thickness detector is used, and the detection value of the emission pressure is used when only one side is opened, thereby controlling the opening amount. The present invention increases life of the film thickness detector.
본 발명은, 증착재료의 방출량을 조정하는 제1조정밸브 및 제2조정밸브의 개방량을 조정하는 개방량 조정공정과, 증착재료의 방출압의 검출값을 취득하는 압력검출공정을 포함하는 진공증착장치의 제어방법에 관한 것으로서, 개방량 조정공정에서는, 제1조정밸브 및 제2조정밸브의 양방이 개방되어 있는 경우에 막두께 검출기에 의한 막두께의 검출값을 사용하고, 어느 일방만이 개방되어 있는 경우에 방출압의 검출값을 사용하여, 개방량을 조정한다.</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3dQ3x8HdRcPMPUnD29wsJ8vfx8fRzVwhzdA4N9VVwcQ3wD_YM8fT3AzLDPJ1deRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJvHeQkYGRoYGBqZGRiYWjMXGqAK61Jvg</recordid><startdate>20210510</startdate><enddate>20210510</enddate><creator>MATSUMOTO YUJI</creator><creator>SHIMIZU YUSUKE</creator><creator>FUJIMOTO EISHI</creator><scope>EVB</scope></search><sort><creationdate>20210510</creationdate><title>METHOD FOR CONTROLLING VACUUM DEPOSITION DEVICE</title><author>MATSUMOTO YUJI ; SHIMIZU YUSUKE ; FUJIMOTO EISHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20210052248A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2021</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUMOTO YUJI</creatorcontrib><creatorcontrib>SHIMIZU YUSUKE</creatorcontrib><creatorcontrib>FUJIMOTO EISHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUMOTO YUJI</au><au>SHIMIZU YUSUKE</au><au>FUJIMOTO EISHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR CONTROLLING VACUUM DEPOSITION DEVICE</title><date>2021-05-10</date><risdate>2021</risdate><abstract>The present invention relates to a control method of a vacuum deposition device, which comprises: an opening degree control process of controlling an opening degree of a first control valve and a second control valve controlling an emission amount of a deposition material; and a pressure detection process of obtaining a detection value of emission pressure of the deposition material. In an opening amount control process, when both sides of the first control valve and the second control valve are opened, a detection value of film thickness by a film thickness detector is used, and the detection value of the emission pressure is used when only one side is opened, thereby controlling the opening amount. The present invention increases life of the film thickness detector.
본 발명은, 증착재료의 방출량을 조정하는 제1조정밸브 및 제2조정밸브의 개방량을 조정하는 개방량 조정공정과, 증착재료의 방출압의 검출값을 취득하는 압력검출공정을 포함하는 진공증착장치의 제어방법에 관한 것으로서, 개방량 조정공정에서는, 제1조정밸브 및 제2조정밸브의 양방이 개방되어 있는 경우에 막두께 검출기에 의한 막두께의 검출값을 사용하고, 어느 일방만이 개방되어 있는 경우에 방출압의 검출값을 사용하여, 개방량을 조정한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHOD FOR CONTROLLING VACUUM DEPOSITION DEVICE |
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