METHOD FOR CONTROLLING VACUUM DEPOSITION DEVICE

The present invention relates to a control method of a vacuum deposition device, which comprises: an opening degree control process of controlling an opening degree of a first control valve and a second control valve controlling an emission amount of a deposition material; and a pressure detection p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATSUMOTO YUJI, SHIMIZU YUSUKE, FUJIMOTO EISHI
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a control method of a vacuum deposition device, which comprises: an opening degree control process of controlling an opening degree of a first control valve and a second control valve controlling an emission amount of a deposition material; and a pressure detection process of obtaining a detection value of emission pressure of the deposition material. In an opening amount control process, when both sides of the first control valve and the second control valve are opened, a detection value of film thickness by a film thickness detector is used, and the detection value of the emission pressure is used when only one side is opened, thereby controlling the opening amount. The present invention increases life of the film thickness detector. 본 발명은, 증착재료의 방출량을 조정하는 제1조정밸브 및 제2조정밸브의 개방량을 조정하는 개방량 조정공정과, 증착재료의 방출압의 검출값을 취득하는 압력검출공정을 포함하는 진공증착장치의 제어방법에 관한 것으로서, 개방량 조정공정에서는, 제1조정밸브 및 제2조정밸브의 양방이 개방되어 있는 경우에 막두께 검출기에 의한 막두께의 검출값을 사용하고, 어느 일방만이 개방되어 있는 경우에 방출압의 검출값을 사용하여, 개방량을 조정한다.