SCAN LASER JIG

The present invention relates to a scan laser jig. The present invention can scan a processed target to precisely recognize a processing reference point of the processed target while scan laser accesses the processed target and prevents the scan laser from being contaminated by foreign substances ge...

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Bibliographische Detailangaben
Hauptverfasser:	LEE JAE IN, KWON HYUN JUNG, KIM JANG SUNG, KO JONG MIN, CHOI CHANG HOON, KIM DONG HUN, CHO TAE IL, KIM KUN OUK, HA SA RAH
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING GRINDING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS POLISHING TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a scan laser jig. The present invention can scan a processed target to precisely recognize a processing reference point of the processed target while scan laser accesses the processed target and prevents the scan laser from being contaminated by foreign substances generated in a processing process or broken since the scan laser is moved inside a scan laser protection box while the processing target is processed by using a processing device. More specifically, according to the present invention, by using the scan laser jig, the processing reference point of the processed target can be safely sensed even in a dangerous working environment such as the processing process using a waterjet device where the scan laser can be easily contaminated or broken. 본 발명은 스캔 레이저 지그에 관한 것으로서, 스캔 레이저가 가공대상에 접근한 상태로 가공대상을 스캔하여 가공대상의 가공 기준점을 정밀하게 파악할 수 있으며, 가공 장치를 이용하여 가공대상을 가공하는 동안 스캔 레이저가 스캔 레이저 보호함의 내부로 이동되어 가공 과정에서 발생되는 이물질로부터 스캔 레이저가 오염되거나 파손되는 것을 방지할 수 있는 것이 특징이다. 특히, 본 발명에 의한 스캔 레이저 지그를 이용하면 워터젯 장치를 이용한 가공 공정과 같이 스캔 레이저가 쉽게 오염되거나 파손될 수 있는 위험한 작업 환경에서도 가공대상의 가공 기준점을 안전하게 감지하도록 할 수 있다.