Epoxy resin composition

The present invention relates to an epoxy resin composition which can be applied to a sealing material for high-temperature operated power semiconductor devices. The epoxy resin composition includes an epoxy resin, a curing agent, a filler, and a curing accelerator. 본 발명은 고온 구동 전력 반도체 봉지재에 적용 가능한 에폭...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HWANG PUNG KOC, PARK CHAN YOUNG, SHIM MYOUNG TAEK
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The present invention relates to an epoxy resin composition which can be applied to a sealing material for high-temperature operated power semiconductor devices. The epoxy resin composition includes an epoxy resin, a curing agent, a filler, and a curing accelerator. 본 발명은 고온 구동 전력 반도체 봉지재에 적용 가능한 에폭시 수지 조성물에 관한 것이다.