Epoxy resin composition
The present invention relates to an epoxy resin composition which can be applied to a sealing material for high-temperature operated power semiconductor devices. The epoxy resin composition includes an epoxy resin, a curing agent, a filler, and a curing accelerator. 본 발명은 고온 구동 전력 반도체 봉지재에 적용 가능한 에폭...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | The present invention relates to an epoxy resin composition which can be applied to a sealing material for high-temperature operated power semiconductor devices. The epoxy resin composition includes an epoxy resin, a curing agent, a filler, and a curing accelerator.
본 발명은 고온 구동 전력 반도체 봉지재에 적용 가능한 에폭시 수지 조성물에 관한 것이다. |
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