BONDING HEAD DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

The bonding head of a die bonding device comprises a head body, a heat press part mounted on the lower surface of the head body to adsorb and heat at least one die and include a heater having a first heat generating surface facing the adsorption surface of the die; and at least one thermal compensat...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI SE BIN, LEE JONG GU, LEE SANG HOON, KIM BYUNG JO, LEE SUK WON, KIM SUNG HYUP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The bonding head of a die bonding device comprises a head body, a heat press part mounted on the lower surface of the head body to adsorb and heat at least one die and include a heater having a first heat generating surface facing the adsorption surface of the die; and at least one thermal compensation part including a thermal compensation block having a second heating surface extending downward from the outer region of the die on the lower surface of the head body and facing a side surface of the die adsorbed to the heat press part to generate heat by a heat source provided therein. It is possible to provide a uniform temperature distribution inside the die during die bonding. 다이 본딩 장치의 본딩 헤드는 헤드 본체, 상기 헤드 본체의 하부면에 장착되어 적어도 하나의 다이를 흡착 및 가열하고 상기 다이의 흡착면을 향하는 제1 발열면을 갖는 히터를 포함하는 열 가압부, 및 상기 헤드 본체의 하부면 상에서 상기 다이의 외측 영역에서 아래로 연장하고 상기 열 가압부에 흡착된 상기 다이의 측면을 향하며 내부에 구비된 열원에 의하여 발열하는 제2 발열면을 갖는 적어도 하나의 열 보상 블록을 포함하는 열 보상부를 포함한다.