Bonding apparatus of semiconductor chip

According to the technical idea of the present invention, a semiconductor chip bonding device comprises: a bonding head adsorbing and holding a semiconductor chip; a bonding stage on which a substrate on which the semiconductor chip is mounted is disposed and a process of mounting and bonding the se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM HUI JAE, SHIN JAE BONG, SEOK SEUNG DAE, KIM SANG YOON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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