PRINTED CIRCUIT BOARD AND MEHOD OF MANUFACTURING THEREOF

According to an embodiment of the present invention, a printed circuit board includes: a first insulation layer; a first circuit pattern arranged on the bottom surface or inside of the first insulation layer; a second circuit pattern arranged on the top surface of the first insulation layer; a secon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NA SE WOONG, YANG EUI YEOL, YOO DO HYUK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	According to an embodiment of the present invention, a printed circuit board includes: a first insulation layer; a first circuit pattern arranged on the bottom surface or inside of the first insulation layer; a second circuit pattern arranged on the top surface of the first insulation layer; a second insulation layer arranged on the top surface of the first insulation layer to surround the second circuit pattern; and a protection layer arranged on the top surface of the second insulation layer, wherein the second insulation layer has at least one recess formed in the top surface thereof, and the protection layer is arranged in the recess formed in the top surface of the second insulation layer. The present invention provides the printed circuit board capable of improving reliability and the manufacturing method thereof. 실시 예에 따른 인쇄회로기판은 제1 절연층; 상기 제1 절연층의 하면 또는 내부에 배치된 제1 회로 패턴; 상기 제1 절연층의 상면에 배치된 제2 회로 패턴; 상기 제1 절연층의 상기 상면에 배치되고, 상기 제2 회로 패턴의 주위를 둘러싸는 제2 절연층; 및 상기 제2 절연층의 상면에 배치되는 보호층을 포함하고, 상기 제2 절연층은, 상면에 적어도 하나의 리세스가 형성되고, 상기 보호층은, 상기 제2 절연층의 상면에 형성된 상기 리세스 내에 배치된다.