PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT

The present invention relates to a board with an embedded electronic component, which includes: a core layer having a groove with a bottom surface; an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove; and an insulating layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HAM HO HYUNG, SIM JAE SUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a board with an embedded electronic component, which includes: a core layer having a groove with a bottom surface; an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove; and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer fills at least a portion of a space between the bottom surface of the groove and the electronic component, thereby reducing a possibility of warpage. 본 개시는 바닥면을 갖는 홈부를 갖는 코어층, 상기 홈부의 바닥면 상에 상기 홈부의 바닥면과 이격되어 배치된 전자부품, 및 상기 코어층 상에 배치되며, 상기 전자부품의 적어도 일부를 덮는 절연층을 포함하며, 상기 절연층은, 상기 홈부의 바닥면 및 상기 전자부품 사이의 적어도 일부를 채우는 전자부품 내장기판에 관한 것이다.