BONDING APPARATUS AND APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE COMPRISING THE SAME

Provided are a bonding device which improves connection reliability between substrates for semiconductor packages, and a manufacturing facility of a semiconductor package including the same. The bonding device comprises: a body unit; a vacuum hole in the body unit; a first protrusion unit protruding...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE SANG HOON, AHN SEOK GEUN, JANG BYOUNG WOOK, KWAK MIN KEUN, SHIN JI WON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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