ETCHING COMPOSITION FOR SILICON NITRIDE LAYER AND ETCHING PROCESS OF SILICON NITRIDE LAYER USING THE SAME

Disclosed are: a composition for etching a silicon nitride layer containing a phosphoric acid compound, water, and a predetermined first compound, a reaction product of the first compound, a predetermined second compound, a reaction product of the second compound, or a combination thereof; and an et...

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Hauptverfasser: JANG JUN YOUNG, CHOI JUNG MIN, CHO YOUN JIN, MOON HYUNG RANG, HAN KWEN WOO, HWANG KI WOOK, KIM YUN JUN
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Sprache:eng ; kor
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creator JANG JUN YOUNG
CHOI JUNG MIN
CHO YOUN JIN
MOON HYUNG RANG
HAN KWEN WOO
HWANG KI WOOK
KIM YUN JUN
description Disclosed are: a composition for etching a silicon nitride layer containing a phosphoric acid compound, water, and a predetermined first compound, a reaction product of the first compound, a predetermined second compound, a reaction product of the second compound, or a combination thereof; and an etching method performed by using the same. In the present invention, an etching selectivity for the silicon nitride layer is improved compared to a silicon oxide layer. 인산화합물; 물; 및 소정의 제1화합물, 상기 제1화합물의 반응 생성물, 소정의 제2화합물, 상기 제2화합물의 반응 생성물 또는 이들의 조합; 을 포함한 실리콘 질화막 식각용 조성물, 및 이를 이용하여 수행되는 식각 방법이 개시된다.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20200124574A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20200124574A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20200124574A3</originalsourceid><addsrcrecordid>eNrjZMh0DXH28PRzV3D29w3wD_YM8fT3U3DzD1II9vTxdAay_TxDgjxdXBV8HCNdgxQc_VwUYDoCgvydXYODFfzdcCgODQYpC_FwVQh29HXlYWBNS8wpTuWF0twMym4go3RTC_LjU4sLEpNT81JL4r2DjAyMDAwMjUxMzU0cjYlTBQAjKzaP</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ETCHING COMPOSITION FOR SILICON NITRIDE LAYER AND ETCHING PROCESS OF SILICON NITRIDE LAYER USING THE SAME</title><source>esp@cenet</source><creator>JANG JUN YOUNG ; CHOI JUNG MIN ; CHO YOUN JIN ; MOON HYUNG RANG ; HAN KWEN WOO ; HWANG KI WOOK ; KIM YUN JUN</creator><creatorcontrib>JANG JUN YOUNG ; CHOI JUNG MIN ; CHO YOUN JIN ; MOON HYUNG RANG ; HAN KWEN WOO ; HWANG KI WOOK ; KIM YUN JUN</creatorcontrib><description>Disclosed are: a composition for etching a silicon nitride layer containing a phosphoric acid compound, water, and a predetermined first compound, a reaction product of the first compound, a predetermined second compound, a reaction product of the second compound, or a combination thereof; and an etching method performed by using the same. In the present invention, an etching selectivity for the silicon nitride layer is improved compared to a silicon oxide layer. 인산화합물; 물; 및 소정의 제1화합물, 상기 제1화합물의 반응 생성물, 소정의 제2화합물, 상기 제2화합물의 반응 생성물 또는 이들의 조합; 을 포함한 실리콘 질화막 식각용 조성물, 및 이를 이용하여 수행되는 식각 방법이 개시된다.</description><language>eng ; kor</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201103&amp;DB=EPODOC&amp;CC=KR&amp;NR=20200124574A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201103&amp;DB=EPODOC&amp;CC=KR&amp;NR=20200124574A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JANG JUN YOUNG</creatorcontrib><creatorcontrib>CHOI JUNG MIN</creatorcontrib><creatorcontrib>CHO YOUN JIN</creatorcontrib><creatorcontrib>MOON HYUNG RANG</creatorcontrib><creatorcontrib>HAN KWEN WOO</creatorcontrib><creatorcontrib>HWANG KI WOOK</creatorcontrib><creatorcontrib>KIM YUN JUN</creatorcontrib><title>ETCHING COMPOSITION FOR SILICON NITRIDE LAYER AND ETCHING PROCESS OF SILICON NITRIDE LAYER USING THE SAME</title><description>Disclosed are: a composition for etching a silicon nitride layer containing a phosphoric acid compound, water, and a predetermined first compound, a reaction product of the first compound, a predetermined second compound, a reaction product of the second compound, or a combination thereof; and an etching method performed by using the same. In the present invention, an etching selectivity for the silicon nitride layer is improved compared to a silicon oxide layer. 인산화합물; 물; 및 소정의 제1화합물, 상기 제1화합물의 반응 생성물, 소정의 제2화합물, 상기 제2화합물의 반응 생성물 또는 이들의 조합; 을 포함한 실리콘 질화막 식각용 조성물, 및 이를 이용하여 수행되는 식각 방법이 개시된다.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMh0DXH28PRzV3D29w3wD_YM8fT3U3DzD1II9vTxdAay_TxDgjxdXBV8HCNdgxQc_VwUYDoCgvydXYODFfzdcCgODQYpC_FwVQh29HXlYWBNS8wpTuWF0twMym4go3RTC_LjU4sLEpNT81JL4r2DjAyMDAwMjUxMzU0cjYlTBQAjKzaP</recordid><startdate>20201103</startdate><enddate>20201103</enddate><creator>JANG JUN YOUNG</creator><creator>CHOI JUNG MIN</creator><creator>CHO YOUN JIN</creator><creator>MOON HYUNG RANG</creator><creator>HAN KWEN WOO</creator><creator>HWANG KI WOOK</creator><creator>KIM YUN JUN</creator><scope>EVB</scope></search><sort><creationdate>20201103</creationdate><title>ETCHING COMPOSITION FOR SILICON NITRIDE LAYER AND ETCHING PROCESS OF SILICON NITRIDE LAYER USING THE SAME</title><author>JANG JUN YOUNG ; CHOI JUNG MIN ; CHO YOUN JIN ; MOON HYUNG RANG ; HAN KWEN WOO ; HWANG KI WOOK ; KIM YUN JUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20200124574A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2020</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JANG JUN YOUNG</creatorcontrib><creatorcontrib>CHOI JUNG MIN</creatorcontrib><creatorcontrib>CHO YOUN JIN</creatorcontrib><creatorcontrib>MOON HYUNG RANG</creatorcontrib><creatorcontrib>HAN KWEN WOO</creatorcontrib><creatorcontrib>HWANG KI WOOK</creatorcontrib><creatorcontrib>KIM YUN JUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JANG JUN YOUNG</au><au>CHOI JUNG MIN</au><au>CHO YOUN JIN</au><au>MOON HYUNG RANG</au><au>HAN KWEN WOO</au><au>HWANG KI WOOK</au><au>KIM YUN JUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ETCHING COMPOSITION FOR SILICON NITRIDE LAYER AND ETCHING PROCESS OF SILICON NITRIDE LAYER USING THE SAME</title><date>2020-11-03</date><risdate>2020</risdate><abstract>Disclosed are: a composition for etching a silicon nitride layer containing a phosphoric acid compound, water, and a predetermined first compound, a reaction product of the first compound, a predetermined second compound, a reaction product of the second compound, or a combination thereof; and an etching method performed by using the same. In the present invention, an etching selectivity for the silicon nitride layer is improved compared to a silicon oxide layer. 인산화합물; 물; 및 소정의 제1화합물, 상기 제1화합물의 반응 생성물, 소정의 제2화합물, 상기 제2화합물의 반응 생성물 또는 이들의 조합; 을 포함한 실리콘 질화막 식각용 조성물, 및 이를 이용하여 수행되는 식각 방법이 개시된다.</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
title ETCHING COMPOSITION FOR SILICON NITRIDE LAYER AND ETCHING PROCESS OF SILICON NITRIDE LAYER USING THE SAME
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