ETCHING APPARATUS AND ETCHING METHOD THEREOF

The present invention relates to an etching device and an etching method thereof. The etching device capable of improving etching performance comprises: an etching solution supply unit supplying an etching solution to an etch chamber; a rinse liquid supply unit supplying a rinse liquid to the etch c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	BAE JEONGHYUN, CHO HYUNDONG, PARK SEONGHWAN, LEE YANGHO, LEE SEUNGHOON, MO SUNGWON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to an etching device and an etching method thereof. The etching device capable of improving etching performance comprises: an etching solution supply unit supplying an etching solution to an etch chamber; a rinse liquid supply unit supplying a rinse liquid to the etch chamber; a cleaning liquid supply unit supplying a cleaning liquid to the etch chamber; and a first pressurization holding unit holding at least one of the etch chamber and the etching solution supply unit in a pressurized atmosphere. 본 발명은 식각장치 및 그 식각방법에 관한 것으로, 식각챔버에 식각액을 공급하는 식각액공급부와, 식각챔버에 린스액을 공급하는 린스액공급부와, 식각챔버에 세정액을 공급하는 세정액공급부 및, 식각챔버와 식각액공급부 중 적어도 어느 하나를 가압 분위기로 유지시키는 제1가압유지부를 포함한다.