SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING OF METAL FILM

본 발명은 표면처리 조성물 및 그것을 이용한 표면처리 방법에 관한 것으로서, 본 발명의 일 실시예에 따른 표면처리 조성물은, 연마입자; 금속 에칭제; 안정화제; 및 에칭억제제;를 포함한다.

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Bibliographische Detailangaben
Hauptverfasser:	HWANG JIN SOOK, LEE EUN JIN, SHINRA, KONG HYUN GOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES
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Beschreibung
Zusammenfassung:	본 발명은 표면처리 조성물 및 그것을 이용한 표면처리 방법에 관한 것으로서, 본 발명의 일 실시예에 따른 표면처리 조성물은, 연마입자; 금속 에칭제; 안정화제; 및 에칭억제제;를 포함한다.