POLYAMIDE BASED COMPOSITION AND POLYAMIDE MOLDED ARTICLE

An embodiment of the present invention provides a polyamide-based composition including 95 to 99% by weight of polyamide and 1 to 5% by weight of amino triazole, and a polyamide molded article. The present invention provides excellent mechanical properties. 본 발명의 일 실시예는, 95 내지 99 중량%의 폴리아미드 및 1 내지 5...

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Bibliographische Detailangaben
1. Verfasser:	KANGSUK LEE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	An embodiment of the present invention provides a polyamide-based composition including 95 to 99% by weight of polyamide and 1 to 5% by weight of amino triazole, and a polyamide molded article. The present invention provides excellent mechanical properties. 본 발명의 일 실시예는, 95 내지 99 중량%의 폴리아미드 및 1 내지 5 중량%의 아미노 트리아졸을 포함하는 폴리아미드계 조성물 및 폴리아미드 성형품을 제공한다.