LEAD FREE SOLDER COMPOSITION

According to one embodiment of the present invention, a lead-free solder alloy composition includes: alloy solder containing Sn; and high entropy alloy nanopowder. Therefore, the lead-free solder alloy composition can have excellent soldering and mechanical properties. 본 발명의 일 실시예에 의한 무연솔더 합금 조성물은 S...

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Bibliographische Detailangaben
Hauptverfasser:	RAJENDRAN SRI HARINI, JUNG JAE PIL
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	According to one embodiment of the present invention, a lead-free solder alloy composition includes: alloy solder containing Sn; and high entropy alloy nanopowder. Therefore, the lead-free solder alloy composition can have excellent soldering and mechanical properties. 본 발명의 일 실시예에 의한 무연솔더 합금 조성물은 Sn을 포함하는 합금 솔더 및 고 엔트로피 합금 나노 분말을 포함한다.